Epoxy Adhesives Overview - High Temperature Products

3, epoxy - anhydride system (1) KH-509 adhesive. Formula (parts by mass):
Phenolic Epoxy F-44 647 Anhydride Titanium Dioxide (200 mesh) Glass Powder (200 mesh)
100 80 50 50
After the resin and anhydride were melted and mixed at 80°C, the filler was added and mixed thoroughly.
Curing conditions: 150°C/3h or 150°C/1h+200°C/2h.
Performance: long-term working temperature 200 ~ 250 °C, instant high temperature 1000 °C. Used for bonding high-temperature non-structural parts and ablative materials.

(2) R-122 adhesive. Formula (parts by mass):
Dicyclopentadiene Dioxide R-122 Maleic anhydride Glycerine Quartz White silica 100 51 7.5 30 5
Curing conditions: 120°C/1h+150°C/2h+200°C/3h.
Performance: Shear strength (A1-A1), MPa. Room temperature 12.8, 100 °C 11.6, 150 °C 14.0, 200 °C 15. 5.

(3) Bisphenol S epoxy adhesive. Formula (parts by mass):
Bisphenol S Epoxy (epoxy value 0.54) MNA Anhydride DMP-30 Bisphenol S
100 80 1 2
Gel time 135 °C, 7 min.
Curing conditions: 135°C/2h+165°C/4h+200°C/16h.
Performance: Heat distortion temperature 199 °C. The heat distortion temperature after aging at 200°C/500h was 249°C, and the heat aging loss weight was 0.1%.

4, epoxy - phenolic system (1) CG-I-1 adhesive. Formula (parts by mass):
Epoxy resin E-42 100, phenolic resin 60.
Curing conditions: 110°C/1h+180°C/10h. Pressure 0.49MPa.
Performance: Shear strength, MPa: room temperature 26.6, 150°C 17.2.
Operating temperature 150 °C.

(2) Chenggong-1 adhesive. Formula (parts by mass):
Epoxy resin E-42 100, ammonia phenolic resin 22.5-30, resorcinol 7.5-10.
Curing conditions: After preheating at 80° C./30 min, pressure was applied 0.49 MPa, 105° C./1 h+150° C./1 h.
Performance: Shear strength (Al-A1), MPa: 18.1 at room temperature, 190°C 17.6, 220°C 15.3, 200°C/200h after aging 13.8. Water resistance, oil resistance, and brittleness.

(3) FHJ-12 adhesive. Formula (parts by mass):
Epoxy resin E-51 Phenolic resin Hexamethylene tetraamine 8-hydroxyquinoline Alumina powder 10 100 4 1.1 50
Curing conditions: 160°C/12h.
Performance: Shear strength (steel-steel): room temperature> 17.6 MPa, 150°C> 15.7 MPa. Use temperature 150 °C.

Electronic Packaging

 

Electronic Packaging is a high-end packaging requirement`s industry ,the most popular box is Apple Mobile Phone Box ,wireless blue tooth speaker . we already make many box for mobile hone brand ,like Huawei ,and our quality is very good enough .

it is very popular in the world ,and then it always can be luxury gift ,so it need beautiful and quality packaging box for keeping their shipping safety and gift box for making it like a gift .

That is what we can do for your mobile phone ,provide custom packaging box.

 

Following is some of picture for electronic packaging :

 

 electronic packaging box

If you are interesting in make beautiful and safety box for your electronic packaging ,please email me freely

Electronic Packaging

Electronic Packaging,Electronic Blister Packaging,Plastic Electronic Packaging,Electronic Toy Packaging

Huizhou Cailang Printing Products Co.,Ltd. , http://www.paperboxs.nl