Texas Instruments introduces the industry's highest integrated audio codec for mobile devices
A few days ago, Texas Instruments (TI) launched an industry's highest integrated audio codec with an embedded miniDSP core, which can cancel echo and noise in applications with broadband speech sampling rates up to 16kHz. The TLV320AIC3262 highly integrates 5 amplifiers and 2 miniDSP cores, which can help designers connect 3 devices at the same time, such as applications, Bluetooth and baseband processors. Audio voice samples can be seamlessly received, mixed, and processed in the codec, and the codec is configured with both TI audio voice algorithms and third-party algorithms, and can also be used as other licenses for designers to create on mobile devices The versatile high-definition audio design brings great advantages.
The third-generation miniDSP technology can cancel broadband noise and echo at frequencies up to 16kHz, bringing high-definition voice quality to circuit-switched or VoIP phones in applications such as video conferencing;
SRSWOWHD & S482; can improve the quality of audio playback, which is a standard feature of the product and does not increase customer costs. It can also increase the processing speed of the host by offloading the task of the host processor to the codec. Designers can also evaluate other certified pre-integrated SRS solutions, including TruMediaTM, CircleSurroundHeadphoneTM and TruSurroundHDTM. The above solutions can be purchased through SRSLabs' direct license agreement;
Three asynchronous audio buses and asynchronous sampling rate conversion (ASRC) allow designers to connect multiple audio resources and configure multiple sampling rates;
The intelligent speaker protection algorithm can control the voice coil temperature and the diaphragm offset to maximize the volume without damaging the speaker.
Availability
The TLV320AIC3262 in 4.8mm x 4.8mm WCSP package is now available.
Tools and support
TLV320AIC3262EVM-U can help designers to evaluate the working performance of TLV320AIC3262. IBIS model and miniDSP software driver are also available.
PurePathTMStudio graphical development environment (GDE) can simplify product design process through miniDSP and audio processing functions. GDE contains all the algorithms from previous software versions, as well as new algorithms and enhanced features specifically for TLV320AIC3262. Compared with the previous generation, the enhanced version of the software can run more algorithms in parallel.
Ensure constant high-quality audio
The TLV320AIC3262 can be easily paired with TI boosted Class D speaker amplifiers such as TPA2015, TPA2025, and TPA2080. These devices can maintain a constant power output when the battery power drops, further enhancing the various algorithms of the TLV320AIC3262 and protecting the speaker.
Designers using different digital signal processing solutions can use TLV320AIC3212 to design, and fully utilize TLV320AIC3262's high integration and various feature advantages without increasing the cost of miniDSP. These 2 codecs are pin-to-pin compatible, and TLV320AIC3212 users can easily upgrade to the miniDSP technology of TLV320AIC3262.
Improve mobile device user experience
Audio is only part of the user experience. TI not only provides a wide range of touch screen controllers and haptic drivers to enhance the mobile device experience, but also provides various series of battery management, wireless power and convenient power solutions to extend battery life.
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