Principle of heat transfer in desktop rapid temperature change test

The heat dissipation of heat conduction depends on the thermal characteristics of the installation connection frame and other connectors. There are many heat dissipation equipment and components, which are required to be installed on heat-absorbing or other devices with good thermal conductivity. Go out.

The test standard for rapid temperature change test shall stipulate the thermal characteristics of the mounting frame, and it is best to re-install these thermal characteristics of the frame during the test. , The worst case should be considered in the test, the application situation is different, and the worst case produced is also different, such as:

1. The high temperature test of the heat dissipation test sample, because the heat transfer direction from the test sample to the mounting frame during the test, so when the heat transfer amount of the mounting frame is minimum, that is, the transfer direction when the thermal conductivity of the mounting frame is minimum is the worst case ;

2. The highest test of the non-heat dissipation test sample, as long as the test sample has not reached thermal stability, the heat is transferred from the box wall to the test sample through the mounting frame. Then, the worst case is the case where the thermal conductivity of the mounting frame is large. In order to avoid installing the bracket The heating time is too long, thereby delaying the heat transfer from the box wall to the test sample, the heat capacity of the mounting frame should be small;

3. The low temperature test of the heat dissipation test sample and the non-heat dissipation test sample. Since the heat is transmitted from the test sample to the wall of the box through the mounting frame during the test, the worst case (the lowest temperature of the test sample) is when the heat transfer efficiency is the highest, ie When the thermal conductivity of the mounting bracket is high.

Note: The heat transfer principle of the high and low temperature test chamber is divided into three parts: heat convection, heat radiation, and heat conduction. Need to know other related content, please search for "Ai Sili" or continue to follow this site!

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